Snapdragon 845 announced, Check out full Specs and Features

Qualcomm has announced its latest Snapdragon 845 flagship chipset. The new Snapdragon 845 packs an octa-core CPU, clocked at up to 2.8 GHz, as well as a new GPU and AI platform, based on the Hexagon 685 DSP. According to the company, there will be an overall “25-percent performance uplift” over the previous generation.

Snapdragon 845 (2)
Snapdragon 845

Snapdragon 845 features

The eight CPU cores also called Kryo 385 will bring better performance. The four cores are based on the Cortex-A75 architecture, while the other four are for efficiency, and based on the Cortex-A55.

The Adreno 630 GPU will handle the graphics department. Qualcomm promises 30% faster graphics and 30% better power efficiency with the new chip. Thanks to a 2.5x faster display throughput, a 2K x 2K display should be able to efficiently run at 120 Hz using the new GPU.

Qualcomm is also touting VR and AR capability right out of the box, including eye tracking, hand tracking, and multiview rendering. The new Hexagon 685 DSP will also work as an AI image coprocessor. This will make voice assistants three times faster than the previous generation. It will support Android 8.1 Oreo’s Neural Networks API for improved always-on keyword detection and super-efficient voice processing.

Snapdragon 845 specifications

Process 10 nm FinFET
CPU 8x Kryo 385 (4x Cortex-A75 up to 2.8 GHz + 4x Cortex-A55 up to 1.8 GHz)
GPU / VPS Adreno 630
Camera Up to 32MP / 16MP +16MP
Video Recording 4K HDR
Max screen resolution 2x 2400×2400 @ 120 FPS (VR)
LTE 1.2 Gbps / 150 Mbps
Wi-Fi 802.11ad Multi-gigabit
AI Platform Hexagon 685
QuickCharge QuickCharge 4/4+

Qualcomm will start shipping the new chipset to smartphone manufacturers in early 2018. The first flagships with the Snapdragon 845 will be the Xiaomi Mi 7. Samsung Galaxy S9 will also feature this new chipset.


ASUS NovaGo world’s first gigabit LTE Windows 10 laptop announced

ASUS today announced world’s first gigabit LTE Windows 10 laptop the NovaGo. The new ASUS NovaGo is a convertible laptop and it comes with Qualcomm’s Snapdragon 835 chipset. That means that it comes with a Snapdragon X16 LTE modem, which offers gigabit LTE speeds.

Microsoft’s Surface Pro also features the Snapdragon X16 modem, but that’s capped at 450Mbps. ASUS says that the NovaGo is the first gigabit LTE laptop.


The device will get up to 22 hours of battery life with active use, or a whopping 30 days of standby. In addition, the convertible ARM-powered PC also includes up to 8GB RAM and up to 256GB of internal storage, with a 13.3-inch 1080p display.

A model with 4GB RAM and 64GB SSD will be available for $599, and you can get one with 8GB RAM and 256GB SSD for $799.


HP Envy x2 with Snapdragon 835 and 20Hr battery life is now official

Today, HP announced its first Snapdragon 835 powered HP Envy x2 tablet. The new always-connected PC includes Snapdragon X16 LTE modem, so it should be able to handle gigabit speeds if your cellular network can handle it.

HP Envy x2 tablet comes in at just 6.9mm thin and 1.54 pounds, and it gets up to 20 hours of battery life, all of which are benefits of using an ARM processor. It also comes with up to 8GB RAM, along with up to 256GB of onboard storage.

HP Envy X2 Specs
HP Envy X2

The device runs Windows 10 S out of the box, however, you can easily upgrade the Envy x2 to Windows 10 Pro. Users can upgrade it for free.

The HP Envy x2 is slated to launch next spring. The company will announce pricing and other details as we get closer to general availability.


Qualcomm Falkor CPU core will feature 48 cores fabbed at 10nm

Qualcomm Falkor CPU core for data-centers is now official. Falkor is the custom CPU design of the Qualcomm Centriq 2400 SoC, which will begin shipping commercially later this year. It’s will come with 48 cores fabbed at 10nm. At the Hot Chips Conference this week, the company will unveil more details of the Qualcomm Falkor CPU core.

Qualcomm Falkor CPU Sihmar (2)
Qualcomm Falkor CPU

key highlights about the Falkor core

Fully custom core design: 

Falkor was designed from the ground up specifically for the cloud datacenter server market. It is 64-bit micro-architecture with fully ARMv8 compliant.

Scalable building block: 

The Falkor core duplex includes two custom Falkor CPUs, a shared L2 cache and a shared bus interface to the Qualcomm System Bus (QSB) ring interconnect. This modular building block serves as the foundation for our highly scalable 48-core Qualcomm Centriq 2400 SoC design.

Designed for performance, optimized for power: 

Qualcomm Falkor CPU is designed to deliver high-end compute performance using a 4-issue, 8-dispatch heterogeneous pipeline. Falkor’s heterogeneous pipeline is designed to optimize performance per unit of power, with variable length pipelines that are tuned per function to maximize throughput and minimize idle hardware. Additionally, Falkor’s out-of-order and rename resources are sized to prevent instruction retirement from being in the performance-critical path, allowing unbridled usage of the multiple execution engines. Other performance-critical elements of the micro-architecture, such as branch prediction algorithms and the cache hierarchy, are state-of-the-art for today’s server class processors. A plethora of sophisticated power management techniques were baked into the design from day one, including such mechanisms as independent p-state control for each of the CPUs and L2, with entry to and exit from low-power states controlled by hardware state machines for ultra-fast state transitions, and hardware state retention for power-collapsed sleep states with ultra-fast recovery.

Performance under memory-intensive workloads: 

Qualcomm Falkor CPU is designed to fulfill the demand for larger instruction footprints using an innovative split instruction cache comprised of a single-cycle, low-power 24KB L0 I-cache complementing its 64KB L1 I-cache. The two caches are managed exclusively to provide a total of 88KB of low-latency I-cache. Optimizing data performance where it’s critical, the core supports a 32KB L1 D-cache with an impressive 3-cycle load-use latency. The L1 D-cache is augmented by a sophisticated multi-level hardware prefetch engine that dynamically adapts to system conditions.

Datacenter features: 

Qualcomm Falkor CPU is ready for multi-tenant and other virtualized workloads with the full suite of ARM Execution Levels (EL0-EL3) and TrustZone secure execution environment. Falkor supports the ARMv8 instruction extensions to accelerate cryptographic transform and secure hash operations needed for efficient performance when running networking security protocols such as https. The new Falkor also delivers on the RAS mechanisms needed to keep a datacenter running, such as a fault isolation, reporting, and handling techniques.

System on a chip: 

The 48 Falkor CPUs are brought together in a fully-integrated SoC, obviating the real estate, power, and cost of a separate chipset. The memory efficiency of the Falkor CPU is extended throughout the SoC with an extremely high-bandwidth and low-latency ring interconnect extending out to its large L3 cache and multiple memory controllers, avoiding on-die NUMA effects. In addition, the memory subsystem includes innovative shared resource management techniques such as L3 Quality of Service (QoS) extensions and effective memory bandwidth enhancement via in-line and transparent memory compression. The SoC also supports an on-die hardware-based immutable root of trust that authenticates firmware before the first line of firmware is ever executed.

Qualcomm Falkor CPU Sihmar (1)
More details about the Qualcomm Centriq 2400 SoC architecture and product specifications will be available in the coming months


Qualcomm Unveils its Depth Sensing Camera Technology

Today, Qualcomm has unveiled its Depth Sensing Camera Technology for Android devices. This is an expansion to its Spectra™ Module Program which will open mobile devices up to high-resolution depth sensing and better biometric authentication.

The program makes use of the same technology as Qualcomm’s Spectra ISPs which you will find embedded in the Snapdragon chips that power many of our phones, and this advances in the technology should eventually make its way to those SoCs.

Qualcomm Unveils its Depth Sensing Camera Technology
Qualcomm’s Depth Sensing Camera Technology

Tim Leland, vice president of product management, Qualcomm Technologies Inc said –

“Whether used for computational photography, video recording, or for computer vision applications that require accurate motion tracking, it’s clear that power efficient camera image signal processing has become more important for the next generation of mobile user experiences. Our breakthrough advancements in visual quality and computer vision, combined with our family of integrated Qualcomm Spectra ISPs for Snapdragon, are designed to support an ecosystem of cutting edge mobile applications for our customers.”

Together, the new ISPs and camera modules are engineered to support superior image quality and new computer vision use cases that utilize deep learning techniques and bokeh quality image experiences with a faster time to market for smartphone and HMD devices.

The next-generation ISPs feature a new camera architecture designed for advancements in computer vision, image quality and power efficiency for the next Snapdragon Mobile and VR Platforms. The camera module program additions consist of a trio of camera modules, including an iris authentication module, a passive depth sensing module and an active depth sensing module.

The low-power, high-performance motion tracking capabilities of the Qualcomm Spectra ISP, in addition to optimized simultaneous localization and mapping (SLAM) algorithms, are designed to support new extended reality (XR) use cases for virtual and augmented reality applications that require SLAM.

The Qualcomm Spectra family of ISPs and new Qualcomm Spectra camera modules will be available with the next flagship Snapdragon Mobile Platform.


Qualcomm announced its under-display fingerprint sensors

Qualcomm has announced its under-display fingerprint sensors, which will allow manufacturers to place their fingerprint sensors under the front display of a phone. Qualcomm Fingerprint Sensors can also be used under metal and glass on the rear of a phone. The sensors work with wet hands and underwater. In addition, manufacturers can also use sensors to detect heart rate and blood flow.


The new Qualcomm ultrasonic sensor uses sound waves to penetrate the glass or metal to work out the pattern of your finger. However, the main limitation is the thickness of the material used.

The Qualcomm Fingerprint Sensor for Display can scan through OLED display stacks of up to 1200um, while the Qualcomm Fingerprint Sensors for Glass and Metal can scan through up to 800 µm of glass and 650 µm of aluminum.

Vivo is currently demoing the new fingerprint sensor at Mobile World Congress 2017. The first devices with under-surface fingerprint sensors are expected to arrive during the first half of 2018. Apple is also trying similar tech for the next iPhone.


Snapdragon 450 announced with 60FPS video, dual cameras, USB 3.0 and more

Today Qualcomm announced it new mid-range Snapdragon 450 chipset. The new Qualcomm’s mid-range smartphone platform now moved to a 14nm process. The new 450 still utilizes Cortex A53 cores, but on a smaller 14nm process. The max clock speed now goes up to 1.8GHz on the 450 versus a max of 1.4GHz on the 435.

Snapdragon 450-Sihmar

A new Hexagon 546 DSP will be up to five times as efficient as the DSP in previous 400-series chips. The new chipset also adds support for 60FPS video capture and playback, dual cameras, USB 3.0, and Qualcomm’s Quick Charge 3.0 technology.

Like the 435, it features Qualcomm’s X9 LTE modem (announced last year), which provides a pretty robust radio feature set for something that’s going to end up in budget phones.

Like the previous gen 435 chipset, it features Qualcomm’s X9 LTE modem. The chipset also includes Adreno 506 GPU, that has twice the number of processing clusters and is built on the 14nm process, resulting in very significant performance and efficiency gains.

According to the Qualcomm, Snapdragon 450 supported devices will start shipping in Q4 of this year.


Snapdragon 660 and 630 is now official with Bluetooth 5 support and more

Qualcomm has announced the Snapdragon 660 and 630. The new processors will replace the 653 and 626 respectively. Both are built on the company’s latest 14nm FinFET process. Both chipsets will include new features like Bluetooth 5 support. The chipsets will also include the All-Ways Aware hub, which is a collection of low-power sensors that provides things like step counting, location tracking, and other background activities without killing battery life.

The chipset also includes USB-C 3.1 support, a Quick Charge 4, and the X12 LTE Modem with 600Mbps, as well as some new video chops via the Spectra 160 ISPs (this processes the raw data from the camera).

Qualcomm Snapdragon 660 Specs

The Snapdragon 660 will replace the reference A72/A53 cores from the 653 with Qualcomm’s Kryo 260 in-house design. According to the Qualcomm, it sees 20% gains over the 650 and 30% increase in GPU performance. It also has Dual Band Simultaneous 2×2 MIMO WiFi (read: fast). The Adreno 512 is now included.


Qualcomm Snapdragon 630 Specs

The Snapdragon 630 comes with eight ARM reference A53s with LPDDR4x support. Four of those are at 2.2GHz and four at 1.8GHz, with an advertised 10% bump in overall performance. It features the Adreno 508 GPU which has the same supposed 30% gains over the previous model, and the max resolution is also a bit higher than the 626 it is replacing, as it now supports up to QXGA (2048 x 1536).

Snapdragon-660-and-630-sihmar (1)

The Qualcomm Snapdragon 660 supported devices will arrive as soon as this quarter, while the 630 is going to be available at the end of May.


Qualcomm Snapdragon 835 specifications leaked ahead of CES

Qualcomm Snapdragon 835 specifications leaked ahead of CES Electronics Show in Las Vegas. The official press release for the processor leaked by the popular leaker Evan Blass (@evleaks). Qualcomm’s latest processor will also be able to run full Windows 10 OS.

According to the leaked press release, Snapdragon 835 is one-of-a-kind processor that’s smaller, faster, and more energy-efficient than any chipset in history. The processor uses a new 10nm design, which makes it 30 percent smaller than Snapdragon 820. Also, Snapdragon 835 uses 40 percent less power than the previous generation and provides up to a 27 percent performance increase.

Snapdragon 835 Features:

Battery Life

Snapdragon 835’s Qualcomm Kryo 280 CPU, Qualcomm Adreno 540 GPU, and Qualcomm Hexagon DSP manage separate workloads — all of them tightly integrated by Qualcomm Symphony System Manager to support better thermals and longer battery life.

Along with the new 10nm design, these multi-pronged, harmonized computing solutions bring unprecedented energy improvements. They include: 1+ day of talk time, 5+ days of music playback, and 7+ hours of 4K video streaming. Should your phone need more power, Qualcomm Quick Charge 4 provides five hours of battery life for five minutes of charging.

Immersive AR and VR Support

Snapdragon 835 features game-changing enhancements to the three most important VR requirements: accurate audio, vibrant visuals, and intuitive interactions. Designed to meet VR processing demands within strict thermal and power constraints, Snapdragon 835 offers 25 percent faster 3D graphic rendering and 60X more display colors when compared to Snapdragon 820.

To generate true-to-life sound, Snapdragon 835 supports scene- and object-based audio and audiophile-grade DSD audio. And for the most intuitive and comfortable user experiences on VR, the new SoC produces a 20 percent reduction in motion-to-photon latency and six-degrees-of-freedom for precise and pleasant motion tracking.


New improved zoom and stabilization for photos and videos by developing highly optimized software algorithms that intelligently toggle between processing sub-systems like the Qualcomm Hexagon DSP, Qualcomm Spectra 180 ISP, and Adreno 540 GPU to deliver a smooth zoom experience. Furthermore, Qualcomm’s newest generation of video stabilization software, EIS 3.0, provides superior, 4K video stabilization through advanced yaw, roll, and rolling shutter correction.

New support for Dual Photodiode (2PD) and enhancements to our hybrid auto-focus framework bring intelligent phase and lighting detection to users’ devices, ensuring that they never miss another important moment because of bad camera focus. And Qualcomm Clear Sight is engineered to fuse together images for improved sharpness, noise reduction, and dynamic range.


Snapdragon 835 is designed to deliver each of these key experiences through the integrated Snapdragon X16 LTE modem and customized support for 802.11ad Wi-Fi, giving power users gigabit and multi-gigabit experiences wherever they are.

Supporting peak download speeds up to 10X faster than first-generation 4G LTE devices, the Snapdragon X16 LTE modem is designed to obtain peak speeds on a number of fronts. The modem hauls in information with advanced 256-QAM digital signal processing, receives data on four antennas through 4×4 MIMO, and supports up to 4X carrier aggregation for optimized peak throughput. And with the new 10nm architecture, the X16 LTE modem has a 45 percent smaller footprint and 60 percent better power efficiency.


Snapdragon 835’s Qualcomm Haven Security Platform provides three layers of security on SoC, device, and system levels. Haven uses pins and fingerprints to authenticate the user interface and eye- and face-based security to authenticate the camera. At the same time, Haven runs device attestation on the software, apps and OS, and hardware. The end result is a security platform that continuously and thoroughly authenticates both the user and the device, protecting the reams of new information and transactions taking place on our phones.

Machine Learning

Snapdragon 835 to make object recognition for better photos, real-time hand-tracking for immersive VR, voice recognition for a low-power virtual assistant, and biometric authentication that knows and protects users.


Qualcomm Snapdragon processors adding Windows 10 support

Microsoft has announced that Qualcomm Snapdragon processors are adding support for Windows 10. Soon you will able to run Windows 10 x86 (32-bit) on ARM-architecture processors. With next-generation ARM CPUs, Windows would be able to run on Qualcomm CPUs with full compatibility.

Qualcomm next-generation processors will be able to run Win32 apps through x86 emulation on Windows 10. In future, Qualcomm’s Snapdragon mobile phone CPUs will able to run powerful desktop apps such as Photoshop or the Office suite.

Previously, Microsoft tried to run Windows on ARM devices, though the first attempt was less than successful. Problem was that developers had to rewrite their applications for compatibility with the ARM-based OS called Windows RT at the time.

Cristiano Amon, the Executive Vice President of Qualcomm Technologies and president of Qualcomm CDMA technologies stated:

“Qualcomm Snapdragon processors offer one of the world’s most advanced mobile computing features, including Gigabit LTE connectivity, advanced multimedia support, machine learning and superior hardware security features, all while supporting thin, fan-less designs and long battery life, With compatibility with the Windows 10 ecosystem, the Qualcomm Snapdragon platform is expected to support mobility to cloud computing and redefine how people will use their compute devices,”

The current generation ARM chips do not support Windows 10 applications. New chips will need to be made for this type of compatibility. Qualcomm’s compatibility with Windows 10 will be thanks to the emulation of the x86 architecture.

According to Microsoft and Qualcomm, Snapdragon processors powered Windows 10 PCs could be available as early as next year. Microsoft Surface Phone could come next year with a new Qualcomm Chip with Windows 10 support.